用于无线通信的孔径耦合馈电微带贴片天线设计

M. Singh, A. Basu, S. Koul
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引用次数: 19

摘要

本文采用0.762 mm和0.508 mm厚(epsivr=3.2)衬底设计和制作了10 GHz微带线馈孔径耦合贴片天线。建议天线的最大尺寸为35.4 mm × 35.4 mm。利用三维电磁模拟器进行参数变化研究,对设计进行了优化。介绍了一种新型的带宽增强网络,该网络能显著提高10db带宽。模拟和测量的辐射方向图适合于无线通信应用。该天线在10 GHz时的增益为6.21dBi。所提出的天线应适用于X波段通信系统,并且较低频率的比例模型易于设计
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design of Aperture Coupled Fed Micro-Strip Patch Antenna for Wireless Communication
In this paper design and fabrication of microstrip line fed aperture coupled patch antenna is presented at 10 GHz using 0.762 mm and .508 mm thick (epsivr=3.2) substrates. The maximum size of proposed antenna is 35.4 mm by 35.4 mm. The design is optimized by means of parameter-variation studies that have been performed using a 3D electromagnetic simulator. A novel bandwidth enhancing network is described, which is shown to improve the 10-dB bandwidth substantially. The simulated and measured radiation pattern is suited for wireless communication applications. The gain of proposed antenna is 6.21dBi at 10 GHz. The proposed antenna should be useful for X band communication systems, and scaled models for lower frequencies are easy to design
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