{"title":"蜂窝手机中的射频前端模块","authors":"Wang-Chang Albert Gu","doi":"10.1109/CSICS.2004.1392545","DOIUrl":null,"url":null,"abstract":"Radio portion of the cellular handsets have evolved from a nearly all-discrete implementation towards a very high level of integration in baseband IC, transceiver ICs and front-end (FE) modules. Integration allows handsets designers to pack more functionalities into a smaller volume with reduced bills of material (BOM) and costs. This paper reviews the FE modules for the 2/sup nd/ generation (2G) handsets followed by a discussion of future trend of FE integration in the emerging multi-band, multi-mode phones for the 2.5G and 3G systems.","PeriodicalId":330585,"journal":{"name":"IEEE Compound Semiconductor Integrated Circuit Symposium, 2004.","volume":"71 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"RF front-end modules in cellular handsets\",\"authors\":\"Wang-Chang Albert Gu\",\"doi\":\"10.1109/CSICS.2004.1392545\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Radio portion of the cellular handsets have evolved from a nearly all-discrete implementation towards a very high level of integration in baseband IC, transceiver ICs and front-end (FE) modules. Integration allows handsets designers to pack more functionalities into a smaller volume with reduced bills of material (BOM) and costs. This paper reviews the FE modules for the 2/sup nd/ generation (2G) handsets followed by a discussion of future trend of FE integration in the emerging multi-band, multi-mode phones for the 2.5G and 3G systems.\",\"PeriodicalId\":330585,\"journal\":{\"name\":\"IEEE Compound Semiconductor Integrated Circuit Symposium, 2004.\",\"volume\":\"71 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-10-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Compound Semiconductor Integrated Circuit Symposium, 2004.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CSICS.2004.1392545\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Compound Semiconductor Integrated Circuit Symposium, 2004.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSICS.2004.1392545","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Radio portion of the cellular handsets have evolved from a nearly all-discrete implementation towards a very high level of integration in baseband IC, transceiver ICs and front-end (FE) modules. Integration allows handsets designers to pack more functionalities into a smaller volume with reduced bills of material (BOM) and costs. This paper reviews the FE modules for the 2/sup nd/ generation (2G) handsets followed by a discussion of future trend of FE integration in the emerging multi-band, multi-mode phones for the 2.5G and 3G systems.
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