新型GaP基稀氮化镓(NAsP)GaP激光材料体系

B. Kunert, K. Volz, J. Koch, T. Torunski, S. Reinhard, S. Borck, K. Hantke, J. Heber, W. Ruhle, W. Stolz
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引用次数: 2

摘要

在硅衬底上实现单片光电集成电路(OIECs)将开辟一个令人兴奋的全新应用领域,即芯片级的光互连。过去,人们一直致力于在Si衬底上生长标准直接带隙III-V化合物半导体,即GaAs/Si或InP/Si。由于这些材料与Si衬底存在较大的晶格失配,在层中形成了大密度的螺纹位错,从而阻碍了相应器件结构的长期稳定激光操作。在这项研究中,作者提出了一种新的直接带隙材料(Ga(NAsP)),它可以生长成晶格匹配的带隙材料。由于GaP和Si的晶格常数相似,这种新型材料体系可能在不久的将来导致基于III/ v的光电子和基于Si的微电子的真正单片集成
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Novel GaP-based dilute nitride Ga(NAsP)GaP laser material system
Realizing monolithic optoelectronic integrated circuits (OIECs) on silicon substrate would open up an exciting and completely new field of applications, i.e. optical interconnects at the chip level. In the past a lot of effort has been devoted to the growth of standard direct band gap III-V compound semiconductors on Si substrate, i.e. GaAs/Si or InP/Si. Due to the large lattice mismatch of these materials to the Si substrate large densities of threading dislocations are formed in the layers, preventing any long-term stable lasing operation of corresponding device structures. In this study the authors present a novel direct band gap material ( Ga(NAsP) ), which can be grown lattice-matched to GaP. Due to the similar lattice constant of GaP and Si, this novel material system might lead to the real monolithic integration of III/V-based optoelectronics and Si-based microelectronics in the near future
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