Mechanical Punching of Through-Holes in Thin Laminates for Higher Density MCM-L Fabrication

This paper outlines a detailed study of the mechanical punching of a variety of non-glass reinforced thin laminates which was carried out to confirm the feasibility of this through-hole generation process. Mechanical punching equipment capable of punching up to 12 holes per second used for this evaluation is capable of generating through-holes down to 60 /spl mu/m in diameter in 50-100 /spl mu/m thick films of an assortment of copper clad thin laminate materials were demonstrated and the salient process parameters discussed. Processes for the fabrication of MCM-L substrates and higher density PWB's using mechanically punched through-holes were also presented.