自动焊接工艺“波峰焊”实验设计(DOE)

27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. Pub Date : 2004-05-13 DOI:10.1109/ISSE.2004.1490447

V. Tsenev, L. Marinov

{"title":"自动焊接工艺“波峰焊”实验设计(DOE)","authors":"V. Tsenev, L. Marinov","doi":"10.1109/ISSE.2004.1490447","DOIUrl":null,"url":null,"abstract":"DOE is a method for improving technological processes after it is proved that they are under control. What is most important about this method is that it requires minimum resources at a moderate risk level. The report describes the application of this method to reduce the defects during automatic soldering of electronic components on a printed circuit board by the \"wave soldering\" process. The input of the process is being influenced only. A mathematical model, based on matrix calculations, is being used in the report.","PeriodicalId":342004,"journal":{"name":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","volume":"23 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Design of experiments (DOE) of automatic soldering process \\\"wave soldering\\\"\",\"authors\":\"V. Tsenev, L. Marinov\",\"doi\":\"10.1109/ISSE.2004.1490447\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"DOE is a method for improving technological processes after it is proved that they are under control. What is most important about this method is that it requires minimum resources at a moderate risk level. The report describes the application of this method to reduce the defects during automatic soldering of electronic components on a printed circuit board by the \\\"wave soldering\\\" process. The input of the process is being influenced only. A mathematical model, based on matrix calculations, is being used in the report.\",\"PeriodicalId\":342004,\"journal\":{\"name\":\"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.\",\"volume\":\"23 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-05-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSE.2004.1490447\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2004.1490447","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 3

摘要

DOE是在工艺过程得到控制后，对其进行改进的一种方法。这种方法最重要的是，它在中等风险水平下需要最少的资源。该报告描述了该方法在通过“波峰焊”工艺在印刷电路板上自动焊接电子元件时减少缺陷的应用。过程的输入只受到影响。报告中正在使用一个以矩阵计算为基础的数学模型。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Design of experiments (DOE) of automatic soldering process "wave soldering"

DOE is a method for improving technological processes after it is proved that they are under control. What is most important about this method is that it requires minimum resources at a moderate risk level. The report describes the application of this method to reduce the defects during automatic soldering of electronic components on a printed circuit board by the "wave soldering" process. The input of the process is being influenced only. A mathematical model, based on matrix calculations, is being used in the report.

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来源期刊

27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004.

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