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光电器件中的可靠性和封装问题

Conference Proceedings. 14th Indium Phosphide and Related Materials Conference (Cat. No.02CH37307) Pub Date : 2002-08-07 DOI:10.1109/ICIPRM.2002.1014422
M. Fukuda
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引用次数: 0

摘要

讨论了当前光纤传输系统(如DWDM、SONET/SDH和数据通信)中使用的InGaAsP/InP激光二极管和光电二极管的可靠性和封装问题。
本文章由计算机程序翻译，如有差异，请以英文原文为准。
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Reliability and packaging issues in optoelectronics
Reliability and packaging issues are discussed for InGaAsP/InP laser diodes and photodiodes used in current optical fiber transmission systems such as DWDM, SONET/SDH, and data communications.
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Conference Proceedings. 14th Indium Phosphide and Related Materials Conference (Cat. No.02CH37307)
Conference Proceedings. 14th Indium Phosphide and Related Materials Conference (Cat. No.02CH37307)
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