半导体制造中基于仿真和基于求解器的批处理优化方法

A. Klemmt, S. Horn, G. Weigert, T. Hielscher
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引用次数: 28

摘要

调度是影响半导体生产效率的关键因素之一。必须优化诸如批量周期时间和吞吐量等目标,以推动技术发展并确保在快速增长的全球市场上生存。但特别是在前端,制造过程被集群工具和重新进入流程所主导,这使得生产计划和优化变得非常困难。这里的工作流主要由分派规则控制。为了进一步改进制造计划策略,对特定工作中心或瓶颈机床群的精确或基于仿真的求解方法的要求越来越高。其中一个例子就是半导体烤箱工艺。在这里,必须安排具有许多限制的复杂批处理过程。通过优化制造策略来减少这部分的周期时间对所有全局优化目标都有很大的影响。本文研究了两种方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Simulations-based and solver-based optimization approaches for batch processes in semiconductor manufacturing
Scheduling is one of the key factors for semiconductor fabrication productivity. Objectives like lot cycle time and throughput must be optimized to push the technological development and secure the existence on the rapid growing global market. But especially in the frontend the manufacturing process is dominated by cluster-tools and reentrance flows which makes a production planning and optimization very hard. The workflow here is mostly controlled only by dispatch rules. To get a further improvement in manufacturing planning strategies, there is an increasing request of exact or simulation-based solution methods for specified work centers or bottleneck machine groups. One example of this is the semiconductor oven process. Here, complex batch processes with a lot of restrictions have to be scheduled. A reduction of cycle time in this section by optimized manufacturing strategies has a great influence on all global optimization objectives. Two approaches are investigated in this paper.
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