在200 mm Si(111)衬底上使用AlGaN/GaN HEMT的异质外延生长和功率器件

T. Egawa
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引用次数: 2

摘要

介绍了硅衬底上mocvd生长的AlGaN/GaN HEMTs的异质外延生长和特性。高温生长的AlGaN/AlN中间层和GaN/AlN应变层超晶格对于提高后续GaN层的晶体质量和在Si上生长较厚的器件结构是有效的。AlGaN/GaN HEMT已成功生长在8英寸的Si上,这表明在这种生长中气相反应最小。该器件具有良好的均匀性、2DEG性能和器件特性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Heteroepitaxial Growth and Power Devices Using AlGaN/GaN HEMT on 200 mm Si (111) Substrate
Developments of heteroepitaxial growth and characteristics of MOCVD-grown AlGaN/GaN HEMTs on Si substrates are presented. High-temperature-grown AlGaN/AlN intermediate layers and GaN/AlN strained layer superlattice are effective in improving the crystal quality of a following GaN layer and in growing thick device structure on Si. The AlGaN/GaN HEMT has been successfully grown on 8-inch Si, which indicates that the gas phase reaction is minimized in this growth. The device exhibited the excellent uniformity, the 2DEG properties and the device characteristics.
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