应变si和应变sige mosfet的HfO/sub 2/

M. Yousif, M. Johansson, P. Lundgren, S. Bengtsson, J. Sundqvist, A. Hårsta, H. Radamson
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引用次数: 0

摘要

本文报道了在应变si和应变sige层上,在600/spl℃的温度下,通过原子层沉积(ALD)生长HfO/sub - 2/ gate介电体。沉积HfO/sub -2/后,Si层的应变状态保持不变,界面态密度为/spl sim/1/spl倍/10/sup 11/ cm/sup -2/ eV/sup -1/。击穿场在2-5 MV/cm范围内,与高温下生长的HfO/sub 2/膜相比,击穿场较高。对于EOT为1.25 nm的HfO/sub 2/薄膜和Si/sub 0.77/Ge/sub 0.23//Si上的超薄帽层(2.5-3 nm),泄漏电流降低了5个数量级以上。在较大的栅极电压范围内,载流子通过HfO/sub /薄膜的输运遵循Frenkel-Poole发射。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
HfO/sub 2/ for strained-Si and strained-SiGe MOSFETs
We report on HfO/sub 2/ gate dielectrics grown by atomic layer deposition (ALD) at 600/spl deg/C on strained-Si and strained-SiGe layers. The strain status in the Si layer remained unaltered after HfO/sub 2/ deposition and an interface state density of /spl sim/1/spl times/10/sup 11/ cm/sup -2/ eV/sup -1/ was obtained for the case of thick HfO/sub 2/ films. The breakdown fields were in the range 2-5 MV/cm, which is high compared to HfO/sub 2/ films grown at higher temperatures. The leakage current was reduced by more than five orders of magnitude for the case of a thin HfO/sub 2/ film with an EOT of 1.25 nm and ultra-thin cap (2.5-3 nm) layers on Si/sub 0.77/Ge/sub 0.23//Si. The carrier transport through these HfO/sub 2/ films was found to follow Frenkel-Poole emission over a wide range of applied gate voltage.
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