铜互连中热致空洞的形成。主要物理参数的评估

2023 IEEE International Reliability Physics Symposium (IRPS) Pub Date : 2023-03-01 DOI:10.1109/IRPS48203.2023.10117870

Y. Ding, O. Pedreira, M. Lofrano, H. Zahedmanesh, T. Chavez, Hosain Farr, I. Wolf, K. Croes

{"title":"铜互连中热致空洞的形成。主要物理参数的评估","authors":"Y. Ding, O. Pedreira, M. Lofrano, H. Zahedmanesh, T. Chavez, Hosain Farr, I. Wolf, K. Croes","doi":"10.1109/IRPS48203.2023.10117870","DOIUrl":null,"url":null,"abstract":"Using a dedicated test structure, the main physical parameters of void formation due to thermomigration (TM) were assessed. Based on physical and electrical void-analyses, we experimentally determined the time to void nucleation and estimated the heat of transport parameter $Q^{\\ast}= 0.21$ eV for Cu interconnects with CD~1µm, Our studies show that TM has a 6x higher contribution to metal flux compared to the initial stress migration (SM) induced by the coefficient of thermal expansion (CTE) mismatch.","PeriodicalId":159030,"journal":{"name":"2023 IEEE International Reliability Physics Symposium (IRPS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters\",\"authors\":\"Y. Ding, O. Pedreira, M. Lofrano, H. Zahedmanesh, T. Chavez, Hosain Farr, I. Wolf, K. Croes\",\"doi\":\"10.1109/IRPS48203.2023.10117870\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Using a dedicated test structure, the main physical parameters of void formation due to thermomigration (TM) were assessed. Based on physical and electrical void-analyses, we experimentally determined the time to void nucleation and estimated the heat of transport parameter $Q^{\\\\ast}= 0.21$ eV for Cu interconnects with CD~1µm, Our studies show that TM has a 6x higher contribution to metal flux compared to the initial stress migration (SM) induced by the coefficient of thermal expansion (CTE) mismatch.\",\"PeriodicalId\":159030,\"journal\":{\"name\":\"2023 IEEE International Reliability Physics Symposium (IRPS)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-03-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2023 IEEE International Reliability Physics Symposium (IRPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRPS48203.2023.10117870\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 IEEE International Reliability Physics Symposium (IRPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS48203.2023.10117870","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

利用专用的测试结构，对热迁移(TM)引起的空隙形成的主要物理参数进行了评估。基于物理和电学上的空洞分析，我们通过实验确定了含CD~1µm的铜互连的空洞成核时间，并估计了输移热参数Q^{\ast}= 0.21$ eV。我们的研究表明，与热膨胀系数(CTE)失配引起的初始应力迁移(SM)相比，TM对金属通量的贡献高6倍。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters

Using a dedicated test structure, the main physical parameters of void formation due to thermomigration (TM) were assessed. Based on physical and electrical void-analyses, we experimentally determined the time to void nucleation and estimated the heat of transport parameter $Q^{\ast}= 0.21$ eV for Cu interconnects with CD~1µm, Our studies show that TM has a 6x higher contribution to metal flux compared to the initial stress migration (SM) induced by the coefficient of thermal expansion (CTE) mismatch.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2023 IEEE International Reliability Physics Symposium (IRPS)

自引率

0.00%

发文量