Cu@SiO2核壳纳米颗粒填充聚偏氟乙烯纳米复合薄膜:制备、表征及介电性能分析

Jianying Du, Wenhu Yang, W. Liao, Z. Xiong, Feng Li, Shuhui Yu, R. Sun
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引用次数: 0

摘要

本文采用简单的方法合成了Cu@SiO2核壳颗粒,并用XRD和SEM技术对其进行了表征。TEM结果表明,在铜颗粒表面均匀地包覆了一层厚度为15 ~ 20 nm的SiO2壳层。对Cu@SiO2颗粒填充PVDF复合材料的介电性能进行了测试和分析。结果表明:PVDF柔性复合材料薄膜的介电常数随填料含量的增加而增大;此外,19vol%的复合薄膜具有明显的非线性I-V特性,表明该薄膜可用于ESD保护电路。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The Cu@SiO2 core-shell nanoparticles filled polyvinylidene fluoride nanocomposites film: Fabrication, characterization and dielectric property analysis
In this paper, the Cu@SiO2 core-shell particles were synthesized using a simple method and well characterized with XRD and SEM techniques. The results of TEM show that a thickness of 15–20 nm SiO2 shell were uniformly coated on the surface of copper particles. The dielectric properties of the PVDF composites filled with Cu@SiO2 particles were measured and analyzed. The results show that the dielectric constant of PVDF flexible composites film increases with increasing filler content. Moreover, the 19vol% composite film presents obvious nonlinear I–V properties, which indicates that this film can be used for ESD protection circuit.
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