Jianying Du, Wenhu Yang, W. Liao, Z. Xiong, Feng Li, Shuhui Yu, R. Sun
{"title":"Cu@SiO2核壳纳米颗粒填充聚偏氟乙烯纳米复合薄膜:制备、表征及介电性能分析","authors":"Jianying Du, Wenhu Yang, W. Liao, Z. Xiong, Feng Li, Shuhui Yu, R. Sun","doi":"10.1109/ICEPT.2017.8046734","DOIUrl":null,"url":null,"abstract":"In this paper, the Cu@SiO2 core-shell particles were synthesized using a simple method and well characterized with XRD and SEM techniques. The results of TEM show that a thickness of 15–20 nm SiO2 shell were uniformly coated on the surface of copper particles. The dielectric properties of the PVDF composites filled with Cu@SiO2 particles were measured and analyzed. The results show that the dielectric constant of PVDF flexible composites film increases with increasing filler content. Moreover, the 19vol% composite film presents obvious nonlinear I–V properties, which indicates that this film can be used for ESD protection circuit.","PeriodicalId":386197,"journal":{"name":"2017 18th International Conference on Electronic Packaging Technology (ICEPT)","volume":"2011 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The Cu@SiO2 core-shell nanoparticles filled polyvinylidene fluoride nanocomposites film: Fabrication, characterization and dielectric property analysis\",\"authors\":\"Jianying Du, Wenhu Yang, W. Liao, Z. Xiong, Feng Li, Shuhui Yu, R. Sun\",\"doi\":\"10.1109/ICEPT.2017.8046734\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, the Cu@SiO2 core-shell particles were synthesized using a simple method and well characterized with XRD and SEM techniques. The results of TEM show that a thickness of 15–20 nm SiO2 shell were uniformly coated on the surface of copper particles. The dielectric properties of the PVDF composites filled with Cu@SiO2 particles were measured and analyzed. The results show that the dielectric constant of PVDF flexible composites film increases with increasing filler content. Moreover, the 19vol% composite film presents obvious nonlinear I–V properties, which indicates that this film can be used for ESD protection circuit.\",\"PeriodicalId\":386197,\"journal\":{\"name\":\"2017 18th International Conference on Electronic Packaging Technology (ICEPT)\",\"volume\":\"2011 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 18th International Conference on Electronic Packaging Technology (ICEPT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2017.8046734\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 18th International Conference on Electronic Packaging Technology (ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2017.8046734","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The Cu@SiO2 core-shell nanoparticles filled polyvinylidene fluoride nanocomposites film: Fabrication, characterization and dielectric property analysis
In this paper, the Cu@SiO2 core-shell particles were synthesized using a simple method and well characterized with XRD and SEM techniques. The results of TEM show that a thickness of 15–20 nm SiO2 shell were uniformly coated on the surface of copper particles. The dielectric properties of the PVDF composites filled with Cu@SiO2 particles were measured and analyzed. The results show that the dielectric constant of PVDF flexible composites film increases with increasing filler content. Moreover, the 19vol% composite film presents obvious nonlinear I–V properties, which indicates that this film can be used for ESD protection circuit.