具有片上无线链路的可持续双电平dvfs NoC

Jacob Murray, Rajath Hegde, Teng Lu, P. Pande, B. Shirazi
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引用次数: 8

摘要

无线片上网络(WiNoC)已成为设计低功耗、高带宽、大规模多核芯片的一种技术。性能优势主要来自于使用无线链路作为相隔很远的核心之间的远程捷径。如果根据流量模式和工作负载优化有线链路的特性和WiNoC的处理核心,则可以进一步增强这种性能增益。在这项工作中,我们证明了通过在WiNoC中结合处理器级和网络级动态电压和频率缩放(DVFS),可以增强功率和热分布,而不会对总体执行时间产生重大影响。我们还表明,根据基准测试应用程序,温度热点可以在处理核心或网络基础设施中形成。所提出的双电平DVFS能够解决这两个问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Sustainable dual-level DVFS-enabled NoC with on-chip wireless links
Wireless Network-on-Chip (WiNoC) has emerged as an enabling technology to design low power and high bandwidth massive multi-core chips. The performance advantages mainly stem from using the wireless links as long-range shortcuts between far apart cores. This performance gain can be enhanced further if the characteristics of the wireline links and the processing cores of the WiNoC are optimized according to the traffic patterns and workloads. In this work, we demonstrate that by incorporating both processor- and network-level dynamic voltage and frequency scaling (DVFS) in a WiNoC, the power and thermal profiles can be enhanced without a significant impact on the overall execution time. We also show that depending on the benchmark applications, temperature hotspots can be formed either in the processing core or in the network infrastructure. The proposed dual-level DVFS is capable of addressing both.
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