片外互连基于测量特性的自动网表提取

S. Corey, A. Yang
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引用次数: 15

摘要

提出了一种基于时域反射测量数据的板级、封装级和MCM基板级互连电路建模方法。多端口系统的时域散射参数用于提取SPICE网表,该网表使用标准元素来匹配设备的行为,直至用户指定的截止频率。可以将线性或非线性电路连接到模型端口,并在标准电路模拟器中模拟整个电路。对两端口和四端口的微带电路进行了表征,并将仿真结果与实测数据进行了比较。在每种情况下,延迟、反射传输和串扰都被精确地建模。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Automatic netlist extraction for measurement-based characterization of off-chip interconnect
An approach is presented for modeling board level, package-level, and MCM substrate-level interconnect circuitry based an measured time domain refectometry data. The time-domain scattering parameters of a multiport system are used to extract a SPICE netlist which uses standard elements to match the behavior of the device up to a user-specified cutoff frequency. Linear or nonlinear circuits may be connected to the model ports, and the entire circuit simulated in a standard circuit simulator. Two-port and four-port example microstrip circuits are characterized, and the simulation results are compared with measured data. Delay, reflection transmission, and crosstalk are accurately modeled in each case.
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