聚酰亚胺隔热结构热驱动微执行器及其在微阀上的应用

H. Kawada, H. Yoshida, M. Kamakura, K. Yoshida, M. Saitou, K. Kawahito, S. Tomonari
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引用次数: 5

摘要

我们开发了一种基于硅(Si) /镍(Ni)对的热/spl中点/隔离双晶结构。用聚酰亚胺梳状结构将2.5 mm长的双晶片束与硅结构的其余部分热隔离。双晶片的Si和Ni层厚度分别为30 /spl mu/m和25 /spl mu/m。这种几何形状使我们能够在约100 /spl度/C下产生高达100 /spl mu/m的双晶圆自由端弯曲位移(行程),产生的力约为15 mN。实现了低电压驱动(<3V)和低能耗(<0.2W)。此外,将小型化的Si/Ni双晶片执行机构集成到阀门结构中。所制阀门的实际尺寸为7.3/spl倍/5.8/spl倍/1.2 mm/sup 3/。在47 kPa的气压下,流量为0 ~ 500 ml/min,泄漏率低,为0.03 ml/min,气压控制线性良好。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Thermally driven microactuator containing thermal isolation structure with polyimide and its application to microvalve
We have developed a thermally /spl middot/ isolated bimorph structure based on a silicon (Si) /nickel (Ni) pair. A 2.5-mm-long beam of the bimorph was thermally isolated by a polyimide comb from the rest of the Si structure. The Si and Ni layers of the bimorph were 30 /spl mu/m and 25 /spl mu/m thick, respectively. This geometry enabled us to generate the bending displacement (the stroke) of the free end of the bimorph up to 100 /spl mu/m at about 100 /spl deg/C with a generated force of about 15 mN. A low-voltage actuation (<3V) and low-energy consumption (<0.2W) were achieved. Besides, the miniaturized Si/Ni bimorph actuator was incorporated into the valve structure. The actual size of the fabricated valve is 7.3/spl times/5.8/spl times/1.2 mm/sup 3/. The flow rate from 0 to 500 ml/min at the air pressure of 47 kPa with low leakage rate of 0.03 ml/min and good linearity of the air pressure control were achieved.
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