壳中壳(si):三维壳谐振器与三维共形壳电极

Sajal Singh, J. Cho, J. Woo, E. Bentley, K. Najafi
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引用次数: 2

摘要

本文报道了一种用于高性能陀螺仪的全熔融硅三维壳(半球形)谐振器和由第二壳制成的电容驱动/感测电极的设计、制造技术和初步测试结果。一个单一的熔融二氧化硅外壳图案形成多个电极,遵循壳谐振器的曲率。10毫米直径的壳谐振器,然后集成在一个更大的壳电极(SiS)。我们的方法首次实现了在微观尺度上制造弯曲电极。与其他电极结构相比,si器件具有较大的重叠面积和几乎均匀的间隙,具有较大的电容,具有更好的频率调谐能力,降低了工作电压,提高了电容灵敏度,降低了温度灵敏度。演示了两个原型si器件的成功制作和测试。在~ 6000 Hz工作频率下,质量因子高达40万,分频低至1.3 Hz。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Shell-in-Shell (SiS): 3D Shell Resonator with 3D Conformal Shell Electrodes
This paper reports the design, fabrication technology and initial testing results of an all fused-silica 3D shell (hemispherical) resonator and capacitive drive/sense electrodes made from a second shell, for use in high-performance gyroscopes. A single fused-silica shell is patterned to form multiple electrodes that follow the curvature of the shell resonator. 10 mm diameter Shell resonator is then integrated inside a larger Shell electrode (SiS). Our approach enables, for the first time, the fabrication of curved electrodes at the micro-scale. The SiS device provides large overlap area and nearly uniform gap with large capacitance for better frequency tuning capability, reduced operating voltages, improved capacitive sensitivity and reduced temperature sensitivity as compared to other electrode architectures. Successful fabrication and testing of two prototype SiS devices are demonstrated. Quality factor as high as of 0.4 Million and frequency split as low as 1.3 Hz is obtained at operating frequency of ~ 6000 Hz.
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