商业焊料合金的最大流动长度及Ni和Co对Sn-0.7wt%Cu焊料合金的影响

K. Nogita, J. Read, S. McDonald, Dong Xu, T. Nishimura
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引用次数: 0

摘要

为了使电子封装的缺陷最小化,在波峰焊工艺中,焊料合金的流动性是一个重要的参数。在这项研究中,我们测量了16种市售焊料的最大流动性长度。我们发现,与其他无铅焊料合金相比,含Ni的合金成分具有更高的流动性长度(类似于共晶Sn-37Pb焊料)。从凝固过程和显微组织方面讨论了Ni和Co对Sn-0.7Cu合金最大流动长度的影响。研究了Sn-0.7Cu合金中Ni和Co的最佳浓度以获得最大流动长度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Maximum Fluidity Length of Commercial Solder Alloys and the Effects of Ni and Co in Sn-0.7wt%Cu Solder Alloys
To make electronic packaging with minimal defects, during the wave soldering process, the fluidity of the solder alloy is an important parameter. In this research we measured the maximum fluidity length of 16 commercially available solders. We found alloy compositions including Ni have higher fluidity lengths (similar to eutectic Sn-37Pb solders) when compared to other Pb-free solder alloys. The effects of Ni and Co on the maximum fluidity length in Sn-0.7Cu alloys is discussed with respect to the solidification process and microstructures. The optimum concentrations of Ni and Co in Sn-0.7Cu alloys to achieve highest maximum fluidity length was investigated.
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