高密度线键FPGA器件串扰与开关噪声机理研究

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) Pub Date : 2008-11-01 DOI:10.1109/EPTC.2008.4763415

S. Tan, Yee Huan Yew, Hong Shi

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引用次数: 1

摘要

本文通过对回路的研究，给出了线键封装中互感的主要影响因素。通过实际设备测量相关性验证了研究结果。在此基础上，将提出减少线键合封装串扰的技术，这将有利于封装界，因为在低成本应用中，键合线仍然是连接芯片和封装的主要技术。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Crosstalk and switching noise mechanism study in high density wire-bond FPGA device

This paper presents the dominant contributors of mutual inductance in wirebond package thru study on the return path. The study is validated through real device measurement correlation. Based on the study, techniques to reduce crosstalk in wire-bond package will be presented which will be beneficial to the packaging world as bond wire continues to be the dominant technique to connect die to the package in low cost application.

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来源期刊

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)

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