铜镍钴锰矿NTC热敏电阻的老化[Cu/sub 0.1/Ni/sub 0.8/Co/sub 0.2/Mn/sub 1.9/O/sub 4/]

2002 23rd International Conference on Microelectronics. Proceedings (Cat. No.02TH8595) Pub Date : 2002-08-07 DOI:10.1109/MIEL.2002.1003215

O. Mrooz, I. Hadzarnan, M. Vakiv, O. Shpotyuk, J. Plewa, H. Altenburg, H. Uphoff

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引用次数: 7

摘要

研究了铜镍钴锰酸盐NTC热敏电阻在125和170℃的热应力下1000 h的老化现象。在NTC热敏电阻中观察到的相对电阻漂移与Cu/sub 0.1/Ni/sub 0.8/Co/sub 0.2/Mn/sub 1.9/O/sub 4/陶瓷微观结构表征(通过光学显微镜、SEM、电子探针和EDX显微分析获得)和热重分析结果相关。

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Aging of copper-nickel-cobalt manganite NTC thermistors [Cu/sub 0.1/Ni/sub 0.8/Co/sub 0.2/Mn/sub 1.9/O/sub 4/]

Aging phenomenon in copper-nickel-cobalt manganite NTC thermistors under thermal stresses at 125 and 170/spl deg/C during 1000 h was studied. The relative resistance drift observed in NTC thermistors is correlated with the results of Cu/sub 0.1/Ni/sub 0.8/Co/sub 0.2/Mn/sub 1.9/O/sub 4/ ceramic microstructures characterization (obtained by optical microscopy, SEM, electron probe and EDX microanalyses) and thermogravimetric analysis.

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来源期刊

2002 23rd International Conference on Microelectronics. Proceedings (Cat. No.02TH8595)

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