S. Yoshioka, Y. Nagatomo, S. Takahashi, S. Miyamoto, M. Uesugi
{"title":"4Mb伪/虚拟SRAM","authors":"S. Yoshioka, Y. Nagatomo, S. Takahashi, S. Miyamoto, M. Uesugi","doi":"10.1109/ISSCC.1987.1157228","DOIUrl":null,"url":null,"abstract":"This report will discuss a 512K×8 CMOS RAM with two modes of self-refresh operation, The chip utilizes a dynamic buried stacked capacitor memory cell that attains a 40fF storage capacitance in 16.8μm2. The design has an access time of 95ns with refresh operation and is assembled in a 600-mil 32 pin dual in line package.","PeriodicalId":102932,"journal":{"name":"1987 IEEE International Solid-State Circuits Conference. Digest of Technical Papers","volume":"2003 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"4Mb pseudo/virtually SRAM\",\"authors\":\"S. Yoshioka, Y. Nagatomo, S. Takahashi, S. Miyamoto, M. Uesugi\",\"doi\":\"10.1109/ISSCC.1987.1157228\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This report will discuss a 512K×8 CMOS RAM with two modes of self-refresh operation, The chip utilizes a dynamic buried stacked capacitor memory cell that attains a 40fF storage capacitance in 16.8μm2. The design has an access time of 95ns with refresh operation and is assembled in a 600-mil 32 pin dual in line package.\",\"PeriodicalId\":102932,\"journal\":{\"name\":\"1987 IEEE International Solid-State Circuits Conference. Digest of Technical Papers\",\"volume\":\"2003 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1987 IEEE International Solid-State Circuits Conference. Digest of Technical Papers\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSCC.1987.1157228\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1987 IEEE International Solid-State Circuits Conference. Digest of Technical Papers","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSCC.1987.1157228","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This report will discuss a 512K×8 CMOS RAM with two modes of self-refresh operation, The chip utilizes a dynamic buried stacked capacitor memory cell that attains a 40fF storage capacitance in 16.8μm2. The design has an access time of 95ns with refresh operation and is assembled in a 600-mil 32 pin dual in line package.