{"title":"粘结剂化学性质对含镀银铝填料的柔性导电粘结剂粘结性能的影响","authors":"T. Fukushima, M. Inoue","doi":"10.23919/ICEP55381.2022.9795487","DOIUrl":null,"url":null,"abstract":"The effect of the binder chemistry on bonding strength and interfacial contact resistivity of flexible electrical conductive adhesives composed of polyhydroxyurethane-based binders and copper electrodes was investigated. The bonding strength with a copper substrate was increased by decreasing the molecular weight of the polyurethane binder and depended on the molecular structure of isocyanate cross-linkers, which were mixed into the binder. In addition, the isocyanate cross-linker was found to affect to increase the interfacial electrical resistance with copper electrodes. These results suggest that binder chemistry influences bonding properties.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"2003 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effect of Binder Chemistry on Bonding Properties of a Flexible Conductive Adhesive Containing Silver-plated Aluminum Fillers\",\"authors\":\"T. Fukushima, M. Inoue\",\"doi\":\"10.23919/ICEP55381.2022.9795487\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The effect of the binder chemistry on bonding strength and interfacial contact resistivity of flexible electrical conductive adhesives composed of polyhydroxyurethane-based binders and copper electrodes was investigated. The bonding strength with a copper substrate was increased by decreasing the molecular weight of the polyurethane binder and depended on the molecular structure of isocyanate cross-linkers, which were mixed into the binder. In addition, the isocyanate cross-linker was found to affect to increase the interfacial electrical resistance with copper electrodes. These results suggest that binder chemistry influences bonding properties.\",\"PeriodicalId\":413776,\"journal\":{\"name\":\"2022 International Conference on Electronics Packaging (ICEP)\",\"volume\":\"2003 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 International Conference on Electronics Packaging (ICEP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/ICEP55381.2022.9795487\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ICEP55381.2022.9795487","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Effect of Binder Chemistry on Bonding Properties of a Flexible Conductive Adhesive Containing Silver-plated Aluminum Fillers
The effect of the binder chemistry on bonding strength and interfacial contact resistivity of flexible electrical conductive adhesives composed of polyhydroxyurethane-based binders and copper electrodes was investigated. The bonding strength with a copper substrate was increased by decreasing the molecular weight of the polyurethane binder and depended on the molecular structure of isocyanate cross-linkers, which were mixed into the binder. In addition, the isocyanate cross-linker was found to affect to increase the interfacial electrical resistance with copper electrodes. These results suggest that binder chemistry influences bonding properties.
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