基于DRAD数字辐射测试芯片的65nm数字电路总电离剂量效应研究

L. M. J. Casas, D. Ceresa, S. Kulis, S. Miryala, J. Christiansen, R. Francisco, D. Gnani
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引用次数: 5

摘要

电子元件的辐射损伤是LHC(大型强子对撞机)探测器上ASIC设计工程师主要关注的问题之一。为了达到ATLAS关键子探测器和CMS升级所用芯片所要求的辐射硬度,需要进行研究。设计了一种数字辐射(DRAD)测试芯片,用于研究总电离剂量(TID)对65nm CMOS技术中数字逻辑门的影响。该芯片研究了9种不同版本的标准单元库,基本上在器件尺寸、$\text{V}_{\mathbf {t\、}}$flavor和器件布局等方面存在差异。每个库有18个测试结构,专门设计用于表征延迟退化和标准单元的功耗。它们基于具有不同门的延迟链和环形振荡器,以及用于测量顺序元件保持和设置时间的特定测试结构。特定的高速结构(VCO和计数器)包括为未来的高速光链路芯片。使用RD53合作辐射工作组的200和500 Mrad晶体管模型对测试结构进行了优化和验证。已经为DRAD芯片开发了一个测试系统,使辐射测试能够在x射线设施中进行。在不同的条件下(温度,偏置和退火),结果高达1Grad。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Study of Total Ionizing Dose Effects in 65nm Digital Circuits with the DRAD Digital RADiation Test Chip
Radiation damage to electronic components is one of the main concerns for LHC (Large Hadron Collider) on-detector ASIC design engineers. Studies are needed in order to achieve the radiation hardness required by the chips used in key sub-detectors of ATLAS and CMS upgrades. A Digital RADiation (DRAD) test chip has been specifically designed to study the impact of Total Ionizing Dose (TID) on digital logic gates in a 65nm CMOS technology. Nine different versions of standard cell libraries are studied in this chip, basically differing in the device dimensions, $\text{V}_{\mathbf {t\, }}$flavor and layout of the device. Each library has eighteen test structures specifically designed to characterize delay degradation and power consumption of the standard cells. They are based on delay chains and ring oscillators with different gates, as well as specific test structures for the measurement of hold and setup time of sequential elements. Specific high speed structures (VCO and counters) are included for future high speed optical links chips. The test structures have been optimized and verified using 200 and 500 Mrad transistor models from the radiation working group of the RD53 collaboration. A test system has been developed for the DRAD chip to enable radiation tests to be performed in X-ray facilities. Results up to 1Grad under different conditions (temperature, bias and annealing) are reported.
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