{"title":"化学干蚀刻设备状态变化的预测过程控制","authors":"Miyuki Maruta, Y. Oomuro, Kazutaka Nagashima","doi":"10.1109/ISSM.2018.8651130","DOIUrl":null,"url":null,"abstract":"In semiconductor production, a compound abnormal factor is undetectable in independent QC (Quality Control) and equipment log management. It is a problem to influence the low yield of semiconductor manufacturing. The predictive model was created by the relation of processing form and some parameters. The motif is CDE (Chemical Dry Etching) equipment. Equipment control using predictive model was considered. Management system was established by monitoring the difference of predicted value and actual value.","PeriodicalId":262428,"journal":{"name":"2018 International Symposium on Semiconductor Manufacturing (ISSM)","volume":"198 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Predictive process control for change in chemical dry etching equipment condition\",\"authors\":\"Miyuki Maruta, Y. Oomuro, Kazutaka Nagashima\",\"doi\":\"10.1109/ISSM.2018.8651130\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In semiconductor production, a compound abnormal factor is undetectable in independent QC (Quality Control) and equipment log management. It is a problem to influence the low yield of semiconductor manufacturing. The predictive model was created by the relation of processing form and some parameters. The motif is CDE (Chemical Dry Etching) equipment. Equipment control using predictive model was considered. Management system was established by monitoring the difference of predicted value and actual value.\",\"PeriodicalId\":262428,\"journal\":{\"name\":\"2018 International Symposium on Semiconductor Manufacturing (ISSM)\",\"volume\":\"198 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 International Symposium on Semiconductor Manufacturing (ISSM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSM.2018.8651130\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 International Symposium on Semiconductor Manufacturing (ISSM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSM.2018.8651130","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Predictive process control for change in chemical dry etching equipment condition
In semiconductor production, a compound abnormal factor is undetectable in independent QC (Quality Control) and equipment log management. It is a problem to influence the low yield of semiconductor manufacturing. The predictive model was created by the relation of processing form and some parameters. The motif is CDE (Chemical Dry Etching) equipment. Equipment control using predictive model was considered. Management system was established by monitoring the difference of predicted value and actual value.