复杂互连的降阶建模研究进展

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI:10.1109/EPEP.2001.967655

S. Grivet-Talocia, I. Maio, F. Canavero

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引用次数: 6

摘要

本文讨论了与复杂互连的降阶建模有关的一些重要问题。研究了两个不同但互补的方向。一方面，利用瞬态散射响应的模型降阶方法，对可能具有复杂几何结构的多端口互连结构进行了分析。另一方面，介绍了具有任意频率相关参数的输电线路的稳定和鲁棒处理的一些最新进展。这两种建模策略都可以自动生成SPICE-ready等效电路，用于系统级仿真。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Recent advances in reduced-order modeling of complex interconnects

This paper addresses some important issues related to reduced-order modeling of complex interconnects. Two different but complementary directions are investigated. On one hand, multiport interconnect structures with possibly complex geometry are analyzed by means of model order reduction from transient scattering responses. On the other hand, some recent advances on stable and robust treatment of transmission lines with arbitrary frequency-dependent parameters are illustrated. Both modeling strategies lead to the automatic generation of a SPICE-ready equivalent circuit for system-level simulation.

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IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)

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