Performance modeling of intercalation doped graphene-nanoribbon interconnects

In this work, we have presented the temperature dependent equivalent single conductor (ESC) model and performance analysis of undoped and doped multilayer graphene nanoribbon (MLGNR) interconnects. The common resistive model of both top-contact and side-contact multilayer GNR interconnects has been demonstrated using multi-conductor based methodology. The propagation delay of pristine (undoped), Arsenic pentafluoride (AsF5), Ferric chloride (FeCl3) and Lithium (Li) intercalation doped MLGNR interconnect is investigated for different temperature and different interconnect length at 16nm technology node. The results show a considerable rise of delay of MLGNR interconnects with the rise of temperature. It is found that AsF5-, FeCl3- and Li-intercalated top-contact MLGNR interconnects show superior resistive performance than that of its pristine counterpart at higher temperature. Li-intercalated TC-MLGNR has been found to be the fastest among all types of MLGNR interconnects as well as conventional Cu over the temperature range from 150K to 450K.