Thermal Interaction In Ld Arrays

We have investigated thermal interaction in laser diode (LD) arrays with the purpose of reducing it. A 250-pn spacing between elements in LD array chip was determined by analysis of thermal dissipation in the chip to largely prevent thermal interaction. However, the thermal interaction in a mounted chip is affected by the temperature rise in the mount, To reduce this temperature rise, we propose temperature stabilizing in which the submount temperature is monitored instead of the heatsink temperature. By the new method, the interactive temperature rise is reduced to 1/3 that obtained by the conventional method.