{"title":"与即将到来的IC设计会面-功率,可变性和NRE爆炸的时代以及未来的一点-","authors":"T. Sakurai","doi":"10.1109/ASPDAC.2007.357773","DOIUrl":null,"url":null,"abstract":"In the foreseeable future, VLSI design will meet a couple of explosions: power, variability and NRE (non-recurring engineering cost). Some of the solutions for power-aware designs are covered in this talk with relation to variability. A remedy for the NRE explosion is to reduce the number of developments and manufacture and sell tens of millions of chips under a fixed design. System-in-a-Package approach may embody such possibility. Several new technologies are described to enable 3-dimensional stacking of chips to build high-performance yet lowpower electronics systems. On the other extreme of the silicon VLSI's which stay as small as a centimeter square, a new domain of electronics called large-area integrated circuit as large as meters is waiting, which may open up a new continent of applications in the era of ubiquitous electronics. One of the implementations of the large-area electronics is based on organic transistors. The talk will provide perspectives of the organic circuit design taking E-skin, sheet-type scanner and Braille display as examples.","PeriodicalId":362373,"journal":{"name":"2007 Asia and South Pacific Design Automation Conference","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Meeting with the Forthcoming IC Design -- The Era of Power, Variability and NRE Explosion and a Bit of the Future --\",\"authors\":\"T. Sakurai\",\"doi\":\"10.1109/ASPDAC.2007.357773\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In the foreseeable future, VLSI design will meet a couple of explosions: power, variability and NRE (non-recurring engineering cost). Some of the solutions for power-aware designs are covered in this talk with relation to variability. A remedy for the NRE explosion is to reduce the number of developments and manufacture and sell tens of millions of chips under a fixed design. System-in-a-Package approach may embody such possibility. Several new technologies are described to enable 3-dimensional stacking of chips to build high-performance yet lowpower electronics systems. On the other extreme of the silicon VLSI's which stay as small as a centimeter square, a new domain of electronics called large-area integrated circuit as large as meters is waiting, which may open up a new continent of applications in the era of ubiquitous electronics. One of the implementations of the large-area electronics is based on organic transistors. The talk will provide perspectives of the organic circuit design taking E-skin, sheet-type scanner and Braille display as examples.\",\"PeriodicalId\":362373,\"journal\":{\"name\":\"2007 Asia and South Pacific Design Automation Conference\",\"volume\":\"34 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-01-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 Asia and South Pacific Design Automation Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASPDAC.2007.357773\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 Asia and South Pacific Design Automation Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASPDAC.2007.357773","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Meeting with the Forthcoming IC Design -- The Era of Power, Variability and NRE Explosion and a Bit of the Future --
In the foreseeable future, VLSI design will meet a couple of explosions: power, variability and NRE (non-recurring engineering cost). Some of the solutions for power-aware designs are covered in this talk with relation to variability. A remedy for the NRE explosion is to reduce the number of developments and manufacture and sell tens of millions of chips under a fixed design. System-in-a-Package approach may embody such possibility. Several new technologies are described to enable 3-dimensional stacking of chips to build high-performance yet lowpower electronics systems. On the other extreme of the silicon VLSI's which stay as small as a centimeter square, a new domain of electronics called large-area integrated circuit as large as meters is waiting, which may open up a new continent of applications in the era of ubiquitous electronics. One of the implementations of the large-area electronics is based on organic transistors. The talk will provide perspectives of the organic circuit design taking E-skin, sheet-type scanner and Braille display as examples.