为智能皮肤航空电子设备开发健壮的混合动力

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI:10.1109/ECTC.1990.122179

T. L. Thomas

{"title":"为智能皮肤航空电子设备开发健壮的混合动力","authors":"T. L. Thomas","doi":"10.1109/ECTC.1990.122179","DOIUrl":null,"url":null,"abstract":"The author presents the conceptualization of robust hybrids which are conformally integrated onto aircraft structure for structural health monitoring applications. The robust hybrid concept exhibits high-performance signal processing and uses advanced hybrid packaging technologies to satisfy conformal integration requirements. The author also discusses the basic issues and requirements of smart skin avionics. The predominant issues of smart skin avionics integration include the thermal management, interconnects and mechanical attachment of modular avionics onto aircraft structure. It is concluded that the development of robust hybrids for sensor processing could introduce smart skins technologies to future avionics systems.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"90 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Development of robust hybrids for smart skin avionics\",\"authors\":\"T. L. Thomas\",\"doi\":\"10.1109/ECTC.1990.122179\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The author presents the conceptualization of robust hybrids which are conformally integrated onto aircraft structure for structural health monitoring applications. The robust hybrid concept exhibits high-performance signal processing and uses advanced hybrid packaging technologies to satisfy conformal integration requirements. The author also discusses the basic issues and requirements of smart skin avionics. The predominant issues of smart skin avionics integration include the thermal management, interconnects and mechanical attachment of modular avionics onto aircraft structure. It is concluded that the development of robust hybrids for sensor processing could introduce smart skins technologies to future avionics systems.<<ETX>>\",\"PeriodicalId\":102875,\"journal\":{\"name\":\"40th Conference Proceedings on Electronic Components and Technology\",\"volume\":\"90 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1990-05-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"40th Conference Proceedings on Electronic Components and Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1990.122179\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"40th Conference Proceedings on Electronic Components and Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1990.122179","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 3

摘要

提出了一种将鲁棒混合动力系统保形集成到飞机结构上用于结构健康监测的概念。稳健的混合概念展示了高性能的信号处理，并使用先进的混合封装技术来满足保形集成要求。讨论了智能皮肤航空电子设备的基本问题和要求。智能蒙皮航空电子设备集成的主要问题包括模块化航空电子设备在飞机结构上的热管理、互连和机械连接。结论是，用于传感器处理的强大混合动力的开发可以将智能皮肤技术引入未来的航空电子系统。

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Development of robust hybrids for smart skin avionics

The author presents the conceptualization of robust hybrids which are conformally integrated onto aircraft structure for structural health monitoring applications. The robust hybrid concept exhibits high-performance signal processing and uses advanced hybrid packaging technologies to satisfy conformal integration requirements. The author also discusses the basic issues and requirements of smart skin avionics. The predominant issues of smart skin avionics integration include the thermal management, interconnects and mechanical attachment of modular avionics onto aircraft structure. It is concluded that the development of robust hybrids for sensor processing could introduce smart skins technologies to future avionics systems.<>

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来源期刊

40th Conference Proceedings on Electronic Components and Technology

CiteScore

3.10

自引率

0.00%

发文量