高温范围内SOI MOSFET的表面迁移率:建模与实验

G. Reichert, T. Ouisse, J. Pelloie, S. Cristoloveanu
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引用次数: 1

摘要

通过使用SOI器件,硅元件的温度范围可以大大延长。在本文中,我们提出了一种新的物理定义,用于表示表面迁移率的经验模型中出现的常用参数。我们还对薄膜SOI MOSFET在298-623K温度范围内的迁移率进行了深入的实验研究。所有数据都符合理论模型,因此可以用于从室温到高温的结果的物理解释。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Surface mobility of SOI MOSFET's in the high temperature range: modelling and experiment
The temperature range of silicon components may be substantially extended by using SOI devices. In this paper, we propose a new physical definition of the usual parameters appearing in the empirical models used for expressing the surface mobility. We also present a thorough experimental study of the mobility in thin film SOI MOSFET's, in the temperature range 298-623K. All data agree with the theoretical model, which may thus be used for a physical interpretation of the results from room to high temperature.
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