寄生基板电流注入时全芯片电位分布的测量和三维模拟

{"title":"寄生基板电流注入时全芯片电位分布的测量和三维模拟","authors":"M. Schenkel, P. Pfaffli, S. Mettler, W. Reiner, W.D. Aemmer","doi":"10.1109/ESSDERC.2000.194849","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":354721,"journal":{"name":"30th European Solid-State Device Research Conference","volume":"2011 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-09-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"15","resultStr":"{\"title\":\"Measurements and 3D Simulations of Full-Chip Potential Distribution at Parasitic Substrate Current Injection\",\"authors\":\"M. Schenkel, P. Pfaffli, S. Mettler, W. Reiner, W.D. Aemmer\",\"doi\":\"10.1109/ESSDERC.2000.194849\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":354721,\"journal\":{\"name\":\"30th European Solid-State Device Research Conference\",\"volume\":\"2011 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-09-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"15\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"30th European Solid-State Device Research Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESSDERC.2000.194849\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"30th European Solid-State Device Research Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESSDERC.2000.194849","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}