{"title":"基于SPICE的电信电源电容器组可靠性设计","authors":"Dan Butnicu, D. Neacşu","doi":"10.1109/SIITME.2017.8259939","DOIUrl":null,"url":null,"abstract":"This paper provides a calculation method for reliability and lifetime of a power supply. The output capacitor bank is demonstrated to be the most critical component. Due to requirements for voltage ripple and ride-through capability, the output capacitor bank is built with a combination of ceramic and electrolytic capacitors. This provides many options and this paper selects among these options based on calculated reliability.","PeriodicalId":138347,"journal":{"name":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Using SPICE for reliability based design of capacitor bank for telecom power supplies\",\"authors\":\"Dan Butnicu, D. Neacşu\",\"doi\":\"10.1109/SIITME.2017.8259939\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper provides a calculation method for reliability and lifetime of a power supply. The output capacitor bank is demonstrated to be the most critical component. Due to requirements for voltage ripple and ride-through capability, the output capacitor bank is built with a combination of ceramic and electrolytic capacitors. This provides many options and this paper selects among these options based on calculated reliability.\",\"PeriodicalId\":138347,\"journal\":{\"name\":\"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)\",\"volume\":\"32 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SIITME.2017.8259939\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SIITME.2017.8259939","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Using SPICE for reliability based design of capacitor bank for telecom power supplies
This paper provides a calculation method for reliability and lifetime of a power supply. The output capacitor bank is demonstrated to be the most critical component. Due to requirements for voltage ripple and ride-through capability, the output capacitor bank is built with a combination of ceramic and electrolytic capacitors. This provides many options and this paper selects among these options based on calculated reliability.