{"title":"三维深度成像与二维强度成像SPAD器件电路的组合设计","authors":"Xiangshun Kong, Guisheng Zhao, Xiong Yang, Hao Chen, Feng Yan, Cheng Mao","doi":"10.1109/CSTIC52283.2021.9461525","DOIUrl":null,"url":null,"abstract":"In this paper, a SP AD device array and circuit for combination of 3D depth imaging and 2D intensity imaging are proposed. Switching between 2D intensity imaging and 3D distance detection can be achieved by mode selection. The on chip TDC has 100 ps time precision in 3D mode and shares a 12-bit counter with the 2D intensity mode. The array size is 1 × 128 and a two-dimensional image can be obtained by rotating or pushing camera system. The chip can be used in lidar, depth imaging, topographic mapping and other fields.","PeriodicalId":186529,"journal":{"name":"2021 China Semiconductor Technology International Conference (CSTIC)","volume":"124 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"A Combination Design of 3D Depth Imaging and 2D Intensity Imaging SPAD Device Circuit\",\"authors\":\"Xiangshun Kong, Guisheng Zhao, Xiong Yang, Hao Chen, Feng Yan, Cheng Mao\",\"doi\":\"10.1109/CSTIC52283.2021.9461525\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, a SP AD device array and circuit for combination of 3D depth imaging and 2D intensity imaging are proposed. Switching between 2D intensity imaging and 3D distance detection can be achieved by mode selection. The on chip TDC has 100 ps time precision in 3D mode and shares a 12-bit counter with the 2D intensity mode. The array size is 1 × 128 and a two-dimensional image can be obtained by rotating or pushing camera system. The chip can be used in lidar, depth imaging, topographic mapping and other fields.\",\"PeriodicalId\":186529,\"journal\":{\"name\":\"2021 China Semiconductor Technology International Conference (CSTIC)\",\"volume\":\"124 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-03-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 China Semiconductor Technology International Conference (CSTIC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CSTIC52283.2021.9461525\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 China Semiconductor Technology International Conference (CSTIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSTIC52283.2021.9461525","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A Combination Design of 3D Depth Imaging and 2D Intensity Imaging SPAD Device Circuit
In this paper, a SP AD device array and circuit for combination of 3D depth imaging and 2D intensity imaging are proposed. Switching between 2D intensity imaging and 3D distance detection can be achieved by mode selection. The on chip TDC has 100 ps time precision in 3D mode and shares a 12-bit counter with the 2D intensity mode. The array size is 1 × 128 and a two-dimensional image can be obtained by rotating or pushing camera system. The chip can be used in lidar, depth imaging, topographic mapping and other fields.
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