多芯片模块快速成型技术

[1991 Proceedings] IEEE International Conference on Computer Design: VLSI in Computers and Processors Pub Date : 1991-10-14 DOI:10.1109/ICCD.1991.139980

R. Miracky, T. Bishop, C. Galanakis, H. Hashemi, T. Hirsch, S. Madere, Heinrich G. Müller, T. Rudwick, L. Smith, S. Sommerfeldt, B. Weigler

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引用次数: 16

摘要

描述了用于多芯片模块(mcm)无掩模定制的组件技术，包括:用于连接和切割导体的激光工艺;互联网络路由工具;以及MCM组装、测试和电气特性方法。每个组件技术都通过独立测试成功地进行了演示。这些技术的第一个集成演示是围绕基于摩托罗拉88100的芯片组定制的三芯片MCM。

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Technologies for rapid prototyping of multi-chip modules

Component technologies are described to be used in the maskless customization of multi-chip modules (MCMs) including: laser processes for linking and cutting conductors; an interconnect net routing tool; and MCM assembly, test, and electrical characterization methods. Each component technology was successfully demonstrated through independent tests. The first integrated demonstration of these technologies is the customization of a three-chip MCM centered around a Motorola 88100-based chip set.<>

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[1991 Proceedings] IEEE International Conference on Computer Design: VLSI in Computers and Processors

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