高性能互连的带宽预测

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Pub Date : 2000-05-21 DOI:10.1109/ECTC.2000.853160

A. Deutsch, G. Kopcsay, P. Coteus, C. Surovic, P. Dahlenz, D. Heckmann, D. Duan

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引用次数: 7

摘要

本文比较了用于高性能计算机和通信系统的片对片和片上互连的主要类别。显示了介质损耗的测量，并比较了印刷电路板、玻璃陶瓷、薄膜和片上布线的衰减。模拟结果显示了代表性的驱动器和接收器电路，当损耗显著时制定了指导方针，并对有用的布线长度的可持续带宽进行了预测。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Bandwidth prediction for high-performance interconnections

This paper compares the major classes of chip-to-chip and on-chips interconnections used in high-performance computers and communication systems. Measurement of dielectric loss is shown and the attenuation is compared for printed-circuit-board, glass-ceramic, thin-film, and on-chip wiring. Simulation results are shown with representative driver and receiver circuits, guidelines are formulated for when losses are significant, and predictions are made for the sustainable bandwidths on useful wiring lengths.

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来源期刊

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)

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