{"title":"有机材料模板打印参数优化","authors":"T. Jiang, S. S. Ahmad, C. Jesse, W. Moden","doi":"10.1109/IEMT.1997.626878","DOIUrl":null,"url":null,"abstract":"Effect of printing speed and squeegee pressure were studied for the quality of stencil printed organic material using a commercially available statistical application, JMP(R). Prints were evaluated by measuring their actual widths compared to the stencil opening in both parallel and perpendicular directions relative to squeegee travel; by print wall angle; film thickness and the extent of material bleed.","PeriodicalId":227971,"journal":{"name":"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium","volume":"10 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Optimizing stencil printing parameters for organic materials\",\"authors\":\"T. Jiang, S. S. Ahmad, C. Jesse, W. Moden\",\"doi\":\"10.1109/IEMT.1997.626878\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Effect of printing speed and squeegee pressure were studied for the quality of stencil printed organic material using a commercially available statistical application, JMP(R). Prints were evaluated by measuring their actual widths compared to the stencil opening in both parallel and perpendicular directions relative to squeegee travel; by print wall angle; film thickness and the extent of material bleed.\",\"PeriodicalId\":227971,\"journal\":{\"name\":\"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium\",\"volume\":\"10 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-10-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.1997.626878\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1997.626878","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Optimizing stencil printing parameters for organic materials
Effect of printing speed and squeegee pressure were studied for the quality of stencil printed organic material using a commercially available statistical application, JMP(R). Prints were evaluated by measuring their actual widths compared to the stencil opening in both parallel and perpendicular directions relative to squeegee travel; by print wall angle; film thickness and the extent of material bleed.