Peng Zhang, Ronggang Han, Rui Jin, K. Yu, Jun Liu, H. Bao, Yu Zhang, J. Che
{"title":"IGBT封装仿真模型的研究","authors":"Peng Zhang, Ronggang Han, Rui Jin, K. Yu, Jun Liu, H. Bao, Yu Zhang, J. Che","doi":"10.1109/ISCID.2013.111","DOIUrl":null,"url":null,"abstract":"Simulation technology provides a powerful tool for the IGBT module design. The IGBT chip model and the interconnect parasitics are the most important factors for the package design of IGBT module. By the aid of the simulation software, the IGBT chip model is fulfilled and the package parasitics is extracted. So the whole simulation deign platform of IGBT package achieves.","PeriodicalId":297027,"journal":{"name":"2013 Sixth International Symposium on Computational Intelligence and Design","volume":"14 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-10-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Research in the Simulation Model of IGBT Package\",\"authors\":\"Peng Zhang, Ronggang Han, Rui Jin, K. Yu, Jun Liu, H. Bao, Yu Zhang, J. Che\",\"doi\":\"10.1109/ISCID.2013.111\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Simulation technology provides a powerful tool for the IGBT module design. The IGBT chip model and the interconnect parasitics are the most important factors for the package design of IGBT module. By the aid of the simulation software, the IGBT chip model is fulfilled and the package parasitics is extracted. So the whole simulation deign platform of IGBT package achieves.\",\"PeriodicalId\":297027,\"journal\":{\"name\":\"2013 Sixth International Symposium on Computational Intelligence and Design\",\"volume\":\"14 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-10-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 Sixth International Symposium on Computational Intelligence and Design\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISCID.2013.111\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 Sixth International Symposium on Computational Intelligence and Design","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISCID.2013.111","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Simulation technology provides a powerful tool for the IGBT module design. The IGBT chip model and the interconnect parasitics are the most important factors for the package design of IGBT module. By the aid of the simulation software, the IGBT chip model is fulfilled and the package parasitics is extracted. So the whole simulation deign platform of IGBT package achieves.
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