集成16通道发射和接收波束形成ASIC超声成像

C. Dusa, Samiyuktha Kalalii, P. Rajalakshmi, O. Rao
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引用次数: 5

摘要

在商用超声系统中,多元件换能器阵列使用长线高压同轴电缆连接到模拟前端电子设备。本文提出了一种可集成在超声探头内的16通道发射(Tx)和接收(Rx)波束形成专用集成电路(ASIC)的电路设计,减少了同轴电缆的数量。所提出的可编程16通道发射波束成形器的模块化设计以脉冲回波模式在医疗频率下工作,并提供用户控制发射参数,如发射脉冲长度、脉冲模式、发射频率和激励模式。接收波束形成器实现了来自16个相邻换能器单元的数字化回波的延迟和相干和,形成图像重建所需的扫描线。所提出的Rx波束前设计架构为波束形成提供了很大的灵活性,例如具有预定延迟轮廓的接收聚焦。每个传输通道可编程,最大延迟为163.85 s,延迟分辨率为1.25 ns。该设计在40 MHz输入数据速率下实现了最小延迟分辨率为3.125 ns的动态接收聚焦。所提出的集成Tx和Rx波束成型机专用集成电路(ASIC)在UMC 130nm工艺下使用Synopsys ICC和Design Compiler实现。实施报告显示,面积为5.29 mm2,功耗为38 mW。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Integrated 16-Channel Transmit and Receive Beamforming ASIC for Ultrasound Imaging
In commercial ultrasound systems, the multielement transducer array is connected to analog front end electronics using long-wire high voltage coaxial cables. This paper presents the circuit design of 16-channel Transmit (Tx) and Receive (Rx) beam forming ASIC (Application Specific Integrated Circuit) that can be integrated in ultrasound probe head which reduces the number of coaxial cables. The proposed modular design for programmable 16-channel transmit beam former operates at medical frequencies in pulse-echo mode and provides user control of transmit parameters such as transmit pulse length, pulse pattern, transmit frequency, and mode of excitation. The receive beam former implements delay and coherent sum of the digitized echoes from 16 adjacent transducer elements to form scan lines required for image reconstruction. The proposed architecture of the Rx beam former design provides great flexibility for beam forming, such as receive focusing with predetermined delay profile. Each transmit channel can be programmable to give a maximum delay of 163.85 s with 1.25 ns delay resolution. The proposed design implements dynamic receive focusing with minimum time delay resolution of 3.125 ns for 40 MHz input data rate. The proposed ASIC of integrated Tx and Rx beam former is implemented in UMC 130 nm technology using Synopsys ICC and Design Compiler. The implementation reports show that the area is 5.29 mm2, power dissipation is 38 mW.
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