{"title":"用于高速高密度集成电路易感性测试的组合网络","authors":"J. Daher, J. P. Rohrbaugh","doi":"10.1109/ISEMC.1986.7568229","DOIUrl":null,"url":null,"abstract":"Table 1. This paper describes various techniques which have been developed for combining high speed digital signals with RF signals for use in measuring the susceptibility characteristics of High Speed, High Density (HSHD) integrated circuits (IC's). Six different combiner networks are evaluated in terms of pin applicability, frequency range, bandwidth, RF-to-digital port isolation, and load sensitivity. This work was sponsored under RADC Contract F30602-85-C-0088.","PeriodicalId":244612,"journal":{"name":"1986 IEEE International Symposium on Electromagnetic Compatibility","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1986-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Combiner Networks for High Speed, High Density Integrated Circuit Susceptibility Testing\",\"authors\":\"J. Daher, J. P. Rohrbaugh\",\"doi\":\"10.1109/ISEMC.1986.7568229\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Table 1. This paper describes various techniques which have been developed for combining high speed digital signals with RF signals for use in measuring the susceptibility characteristics of High Speed, High Density (HSHD) integrated circuits (IC's). Six different combiner networks are evaluated in terms of pin applicability, frequency range, bandwidth, RF-to-digital port isolation, and load sensitivity. This work was sponsored under RADC Contract F30602-85-C-0088.\",\"PeriodicalId\":244612,\"journal\":{\"name\":\"1986 IEEE International Symposium on Electromagnetic Compatibility\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1986-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1986 IEEE International Symposium on Electromagnetic Compatibility\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISEMC.1986.7568229\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1986 IEEE International Symposium on Electromagnetic Compatibility","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEMC.1986.7568229","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Combiner Networks for High Speed, High Density Integrated Circuit Susceptibility Testing
Table 1. This paper describes various techniques which have been developed for combining high speed digital signals with RF signals for use in measuring the susceptibility characteristics of High Speed, High Density (HSHD) integrated circuits (IC's). Six different combiner networks are evaluated in terms of pin applicability, frequency range, bandwidth, RF-to-digital port isolation, and load sensitivity. This work was sponsored under RADC Contract F30602-85-C-0088.
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