微波封装用SU8光聚合物的评价

NORCHIP 2012 Pub Date : 2012-11-01 DOI:10.1109/NORCHP.2012.6403146

Srinivasa Reddy Kuppireddi, S. Pamidighantam, V. Janardhana, O. Søråsen, J. S. Roy, R. G. Kulkarn

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引用次数: 2

摘要

评价了环氧基光聚合物SU8作为射频微机电系统(RFMEMS)封装的微波封装材料。选择标准和开槽共面波导传输线作为测试载体。长度达10mm的传输线是在ST-Cut石英基板上形成的。制造的传输线经受晶圆级封装。测得的s参数数据显示包装前后有显著差异。此外，由于包装的影响是使用集总组件建模和测量数据验证与模拟先进的设计系统。包装前后的实测数据与模拟数据吻合良好。

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Evaluation of SU8 photo polymer for microwave packaging applications

Epoxy based photo polymer - SU8 is evaluated as microwave packaging material for packaging of Radio Frequency Micro Electro Mechanical Systems (RFMEMS). Standard and Slotted Coplanar Waveguide transmission lines are chosen as test vehicles. Transmission lines of lengths up to 10mm are formed on ST-Cut Quartz substrates. The fabricated transmission lines are subjected to wafer level packaging. The measured S-parameter data shows a significant difference prior to and after packaging. Further, the effects due to the packaging are modeled using lumped components and the measured data are validated with simulations in Advanced Design System. The measured and simulated data agree favorably with each other, for both before and after packaging.

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NORCHIP 2012

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