高度不匹配III-V外延异质结构中位错的理论研究

K. Masuda-Jindo, R. Kikuchi
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引用次数: 0

摘要

采用紧密结合分子动力学(TBMD)方法,研究了InGaAs/GaAs、InP/GaAs和InP/Si等中等和高度失配的III-V型半导体异质结构中60/spl度和90/spl度两种应变位错的原子性质。利用路径概率法(PPM)研究了原子在半导体界面中的空位扩散机制。估计了失配位错产生的临界层厚度,并与实验结果进行了比较。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Theoretical study of dislocations in highly mismatched III-V epitaxial heterostructures
Using the tight-binding molecular dynamics (TBMD) method, we study the atomistic properties of strain included dislocations, both 60/spl deg/ and 90/spl deg/ types, in medium and highly mismatched III-V semiconductor heterostructures, like InGaAs/GaAs, InP/GaAs and InP/Si systems. The atomic diffusion in the semiconductor interface is investigated via vacancy mechanism of diffusion using the path probability method (PPM). The critical layer thickness for the generation of the misfit dislocations is also estimated and compared with the experimental results.
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