{"title":"SF6钝化提高硅纳米晶PL量子产率","authors":"R. Liptak, S. Campbell","doi":"10.1109/GROUP4.2008.4638108","DOIUrl":null,"url":null,"abstract":"This paper demonstrates that an in-line SF6 etching process, which is known to produce high concentrations of free fluorine radicals, can be used to size the nanocrystals without creating a polymeric surface layer. As with the CF4 process, Si-NCs fabricated by this process luminesce well, with the luminescent peak wavelength determined by the particle size, which is controlled by the synthesis and etch processes.","PeriodicalId":210345,"journal":{"name":"2008 5th IEEE International Conference on Group IV Photonics","volume":"1983 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-10-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Improved silicon nanocrystal PL quantum yield by SF6 passivation\",\"authors\":\"R. Liptak, S. Campbell\",\"doi\":\"10.1109/GROUP4.2008.4638108\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper demonstrates that an in-line SF6 etching process, which is known to produce high concentrations of free fluorine radicals, can be used to size the nanocrystals without creating a polymeric surface layer. As with the CF4 process, Si-NCs fabricated by this process luminesce well, with the luminescent peak wavelength determined by the particle size, which is controlled by the synthesis and etch processes.\",\"PeriodicalId\":210345,\"journal\":{\"name\":\"2008 5th IEEE International Conference on Group IV Photonics\",\"volume\":\"1983 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-10-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 5th IEEE International Conference on Group IV Photonics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/GROUP4.2008.4638108\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 5th IEEE International Conference on Group IV Photonics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/GROUP4.2008.4638108","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Improved silicon nanocrystal PL quantum yield by SF6 passivation
This paper demonstrates that an in-line SF6 etching process, which is known to produce high concentrations of free fluorine radicals, can be used to size the nanocrystals without creating a polymeric surface layer. As with the CF4 process, Si-NCs fabricated by this process luminesce well, with the luminescent peak wavelength determined by the particle size, which is controlled by the synthesis and etch processes.