E. Cho, T.Y. Kim, C.H. Lee, C. Lee, J. Yoon, H. Cho, H. Kang, Y. Ahn, Donggun Park, Kinam Kim
{"title":"优化了FinFET阵列闪存的单元结构","authors":"E. Cho, T.Y. Kim, C.H. Lee, C. Lee, J. Yoon, H. Cho, H. Kang, Y. Ahn, Donggun Park, Kinam Kim","doi":"10.1109/ESSDER.2004.1356546","DOIUrl":null,"url":null,"abstract":"In this paper, a highly manufacturable 256 M body tied tri-gate fin array NOR-type Flash memory, with 70 nm fin width, was successfully fabricated and the characteristics were compared with planar cell array transistors. In this experiment, a 1.6 times higher driving current of the fin array flash memory cell transistor is achieved than that of a planar device with the same gate length. We propose an optimized fin structure for flash memory operation and a direction for enhanced current of the fin array flash memory cell transistor with respect to the channel silicon plane, coupling ratio, junction profile and anti-punch through implantation conditions.","PeriodicalId":287103,"journal":{"name":"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Optimized cell structure for FinFET array Flash memory\",\"authors\":\"E. Cho, T.Y. Kim, C.H. Lee, C. Lee, J. Yoon, H. Cho, H. Kang, Y. Ahn, Donggun Park, Kinam Kim\",\"doi\":\"10.1109/ESSDER.2004.1356546\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, a highly manufacturable 256 M body tied tri-gate fin array NOR-type Flash memory, with 70 nm fin width, was successfully fabricated and the characteristics were compared with planar cell array transistors. In this experiment, a 1.6 times higher driving current of the fin array flash memory cell transistor is achieved than that of a planar device with the same gate length. We propose an optimized fin structure for flash memory operation and a direction for enhanced current of the fin array flash memory cell transistor with respect to the channel silicon plane, coupling ratio, junction profile and anti-punch through implantation conditions.\",\"PeriodicalId\":287103,\"journal\":{\"name\":\"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)\",\"volume\":\"49 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-11-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESSDER.2004.1356546\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESSDER.2004.1356546","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Optimized cell structure for FinFET array Flash memory
In this paper, a highly manufacturable 256 M body tied tri-gate fin array NOR-type Flash memory, with 70 nm fin width, was successfully fabricated and the characteristics were compared with planar cell array transistors. In this experiment, a 1.6 times higher driving current of the fin array flash memory cell transistor is achieved than that of a planar device with the same gate length. We propose an optimized fin structure for flash memory operation and a direction for enhanced current of the fin array flash memory cell transistor with respect to the channel silicon plane, coupling ratio, junction profile and anti-punch through implantation conditions.