{"title":"硬件实现了“补充对称逻辑电路结构”的概念","authors":"D. Olson, K. Current","doi":"10.1109/ISMVL.2000.848645","DOIUrl":null,"url":null,"abstract":"A test chip was fabricated in a standard 1.2-micron CMOS technology using Supplementary Symmetrical Logic Circuit Structure (SUS-LOC) concepts. The test chip demonstrated several ternary logical functions as well as the flexibility of the SUS-LOC structure. Logic functionality and switching performance of the chip were simulated and verified experimentally. Simulated and experimental results are presented and discussed.","PeriodicalId":334235,"journal":{"name":"Proceedings 30th IEEE International Symposium on Multiple-Valued Logic (ISMVL 2000)","volume":"102 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"Hardware implementation of \\\"Supplementary symmetrical logic circuit structure\\\" concepts\",\"authors\":\"D. Olson, K. Current\",\"doi\":\"10.1109/ISMVL.2000.848645\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A test chip was fabricated in a standard 1.2-micron CMOS technology using Supplementary Symmetrical Logic Circuit Structure (SUS-LOC) concepts. The test chip demonstrated several ternary logical functions as well as the flexibility of the SUS-LOC structure. Logic functionality and switching performance of the chip were simulated and verified experimentally. Simulated and experimental results are presented and discussed.\",\"PeriodicalId\":334235,\"journal\":{\"name\":\"Proceedings 30th IEEE International Symposium on Multiple-Valued Logic (ISMVL 2000)\",\"volume\":\"102 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-05-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings 30th IEEE International Symposium on Multiple-Valued Logic (ISMVL 2000)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISMVL.2000.848645\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 30th IEEE International Symposium on Multiple-Valued Logic (ISMVL 2000)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISMVL.2000.848645","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Hardware implementation of "Supplementary symmetrical logic circuit structure" concepts
A test chip was fabricated in a standard 1.2-micron CMOS technology using Supplementary Symmetrical Logic Circuit Structure (SUS-LOC) concepts. The test chip demonstrated several ternary logical functions as well as the flexibility of the SUS-LOC structure. Logic functionality and switching performance of the chip were simulated and verified experimentally. Simulated and experimental results are presented and discussed.