多核系统的热感知寿命可靠性

Shengquan Wang, Jian-Jia Chen
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引用次数: 38

摘要

随着现代电子电路的功率密度急剧增加,系统容易过热。高温不仅会提高封装成本、降低系统性能、增加泄漏功耗,还会降低系统可靠性。由于单核设计在性能和功率密度等方面存在诸多限制,微处理器行业已将注意力转向多核设计,以实现性能的扩展。多核系统的热效应仍然是一个突出的问题。一个典型的热效应是热感知寿命可靠性,这已经成为一个严重的问题。在本文中,我们讨论了如何在保持给定的总处理器速度的同时最大化多核系统的生命周期。通过应用顺序二次规划,我们介绍了如何获得每个核心的理想速度以最大化系统生命周期。我们在多个多核平台上进行了实验,结果表明,该方法可以通过最小化系统的峰值温度来显著优于现有的方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Thermal-aware lifetime reliability in multicore systems
As the power density of modern electronic circuits increases dramatically, systems are prone to overheating. High temperatures not only raise packaging costs, degrade system performance, and increase leakage power consumption, but also reduce the system reliability. Due to many limits in single core design including the performance and the power density, the microprocessor industry has switched their attentions to multicore design to enable the scaling of performance. Thermal effects on multicore systems are still prominent issues. One typical thermal effect is the thermal-aware lifetime reliability, which has become a serious concern. In this paper, we address the issue on how to maximize the lifetime of multicore systems while maintaining a given aggregate processor speed. By applying sequential quadratic programming, we present how to derive the ideal speed for each core to maximize the system lifetime. We perform experiments on several multi-core platforms, which show that the proposed method can significantly outperform the existing approaches by minimizing the peak temperature of the system.
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