应变InGaAs/InAlAs pHEMTs中扭结效应的物理模拟

S. Arshad, M. Mohiuddin, A. Bouloukou, M. Missous
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引用次数: 6

摘要

InAlAs/InGaAs材料系统提供了在给定栅极尺寸下最高的跨导pHEMT器件之一,因为它具有大的导带不连续,高电子迁移率和通道中非常好的载流子限制。而直流特性在漏极电压定值时漏极电流突然上升,导致漏极电导高,电压增益降低。这种不良现象被称为扭结效应。在这项工作中,使用2-D物理设备模拟器开发了对这种效应的原因的全面理解。模拟的pHEMT是一个层状结构,模拟了MBE生长的制造器件的外延层[1]。所建立的模型考虑了场相关迁移、生成重组机制和深层圈闭。利用这些物理模型,成功地模拟了阈值电压、漏极饱和和栅漏电流,与实测结果吻合较好。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Physical Modelling of the Kink Effect in Strained InGaAs/InAlAs pHEMTs
The InAlAs/InGaAs material system provides one of the highest transconductance pHEMT devices at a given gate size because of its large conduction band discontinuity, high electron mobility and very good carrier confinement in the channel. The DC characteristics, however, show a sudden rise in drain current at fixed value of drain voltage, resulting in high drain conductance and reduced voltage gain. This undesirable phenomenon is called Kink Effect. In this work a comprehensive understanding of the causes of this effect is developed using a 2-D physical device simulator. The modelled pHEMT is a layered structure that simulates the epitaxial layers of the fabricated device grown by MBE[1]. The developed model takes into account field dependent mobility, generation recombination mechanisms and deep-level traps are used. With the help of these physical models, threshold voltage, drain saturation and gate leakage current are successfully simulated and agree well with the measured results.
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