21世纪千兆级集成(GSI):互连问题

J. Meindl
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引用次数: 1

摘要

仅给出摘要形式,如下。从1959年微电子技术的诞生到20世纪90年代初,晶体管在微芯片的性能和成本上占据主导地位,而互连则是次要的。近年来,这种霸权发生了逆转。互连现在倾向于主导微芯片的性能和成本,而晶体管则退居次要地位。例如,对于20世纪80年代后期的1.0 /spl mu/m技术,无负载MOSFET的固有开关延迟接近10 ps,而1.0 mm互连的响应时间约为1 ps。但是,对于2000年初的0.1 /spl mu/m技术,MOSFET的固有延迟减少到约1.0 ps,而1.0 mm互连的响应时间增加到100 ps。时钟频率增加了100倍,对芯片时钟分配网络提出了严格的新要求。供电电流增加了60倍,而供电电压下降了5倍,给配电网带来了巨大的新负担。每个芯片的最大总导线长度增加了50倍,而芯片到封装的输入输出互连数量增加了10倍。互连问题的深刻和普遍性质要求作出回应。这一回应的中心论点是,21世纪早期GSI的机会将受到理论和实践限制的相互联系主导的层次结构的支配,其五个层次分别是基础、材料、设备、电路和系统。对这种限制层次的系统探索揭示了解决互连问题的突出机会。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
XXI century gigascale integration (GSI): the interconnect problem
Summary form only given, as follows. From the inception of microelectronics in 1959 until the early 1990's, transistors dominated both the performance and cost of microchips while interconnects were of secondary importance. In recent years, this hegemony has reversed itself. Interconnects now tend to dominate microchip performance and cost with transistors relegated to the secondary role. As an example, for late 1980's 1.0 /spl mu/m technology, the intrinsic switching delay of an unloaded MOSFET approaches 10 ps while the response time of a 1.0 mm interconnect is approximately 1 ps. But, for early 2000's 0.1 /spl mu/m technology, the intrinsic delay of a MOSFET decreases to about 1.0 ps while the response time of a 1.0 mm interconnect increases to 100 ps. Concurrent with this signal wiring dilemma, clock frequency is increasing by 100X placing stringent new demands on the chip clock distribution network. Supply current is increasing by 60X while supply voltage scales downward by 5X thereby imposing a huge new burden on the power distribution network. Maximum total wire length per chip increases by 50X, while chip-to-package input-output interconnect count increases by 10X. The profound and pervasive nature of the interconnect problem demands a response. The central thesis of this response is that early XXI century opportunities for GSI will be governed by an interconnect dominated hierarchy of theoretical and practical limits whose five levels are codified as fundamental, material, device, circuit and system. Systematic exploration of this hierarchy of limits reveals salient opportunities for addressing the interconnect problem.
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