Hyoung-Seok Oh, C. Kim, Hyun-Kyu Yu, Choong-Ki Kim
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引用次数: 22
摘要
CMOS功率晶体管的低氧化击穿电压和低功率水平下的低功率附加效率(PAE)一直是实现大功率线性功率放大器(PAs)的主要挑战,特别是在深亚微米CMOS技术中。为了解决这些问题,提出了一种内并联的三级联CMOS功率控制方案。所提出的PA完全集成在0.18 μ m CMOS技术中,在3.3V电源电压下提供23dBm的输出功率和35%的PAE。由于最小特征尺寸的薄氧化物晶体管可以用作功率晶体管,因此即使在单级也可以获得19dB的高功率增益。从20dBm的1dB压缩点(P1dB)后退8db时,PAE测量值高达12%
A fully-integrated +23-dBm CMOS triple cascode linear power amplifier with inner-parallel power control scheme
The low oxide breakdown voltage of CMOS power transistor and low power-added efficiency (PAE) at low power levels have been major challenging issues in the implementation of high-power linear power amplifiers (PAs), especially in deep sub-micron CMOS technology. In order to alleviate these problems, a triple cascode CMOS PA with inner-parallel power control scheme is presented. The proposed PA, fully-integrated in 0.18mum CMOS technology, delivers an output power of 23dBm with 35% PAE at 3.3V supply voltage. Since the thin-oxide transistors of the minimum feature size can be utilized as power transistors in the proposed PA, a high power gain of 19dB has been achieved even at single-stage. And PAE at an 8dB-backoff from the 1dB compression point (P1dB) of 20dBm has been measured as high as 12%