LTCC微热管的设计与制造

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI:10.1109/ESTC.2018.8546402

Malika Tlili, Maina Sinou, Camilla Kärnfelt, D. Bourreau, A. Péden

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引用次数: 3

摘要

本文介绍了低温共烧陶瓷(LTCC)模块冷却用微热管(MHP)的制备方法。mhp采用ESL41020磁带制成10层结构。已经测试了不同的制造设置，以尽量减少膨胀和凹槽变形。最好的结果是使用无功胶带，延长烧成轮廓，并在50°C, 70 bar压力下热层压5分钟。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Micro Heat Pipe Design and Fabrication on LTCC

This paper presents work on micro heat pipe (MHP) fabrication in Low Temperature Cofired Ceramics (LTCC) modules for cooling purpose. The MHPs are fabricated in a 10 layer structure using ESL41020 tape. Different fabrication settings have been tested to minimize swelling and groove deformation. The best result is obtained by using fugitive tape, extended firing profile, and hot lamination at 50°C for 5 minutes with 70 bar pressure.

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来源期刊

2018 7th Electronic System-Integration Technology Conference (ESTC)

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