等离子体和电子器件集成电路及其特性

M. Fukuda, H. Sakai, T. Mano, Y. Kimura, M. Ota, M. Fukuhara, T. Aihara, Y. Ishii, T. Ishiyama
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引用次数: 1

摘要

本文提出了一种在硅衬底上与电子器件单片集成的等离子体电路,并讨论了该电路背后的概念。表面等离子体波导和探测器与金属氧化物半导体场效应晶体管(mosfet)集成在衬底上。在电路中,表面等离子体信号由硅是透明波长的光产生,并沿着波导传播,然后由探测器转换成电信号。这些电信号在直流和交流工作期间驱动mosfet。这些器件的测量性能表明,表面等离子体在金属表面以光速传播,驱动电子器件而不被硅吸收。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Plasmonic and electronic device integrated circuits and their characteristics
This paper presents a type of plasmonic circuit that is monolithically integrated with electronic devices on a silicon substrate and discusses the concept behind this circuit. Surface plasmon waveguides and detectors are integrated with metal-oxide-semiconductor field-effect transistors (MOSFETs) on the substrate. In the circuits, surface plasmon signals are generated by light at a wavelength at which silicon is transparent, and propagate along the waveguide before being converted into electrical signals by the detector. These electrical signals drive the MOSFETs during both dc and ac operation. The measured performances of these devices indicate that the surface plasmons propagate on the metal surface at the speed of light and drive the electronic devices without any absorption in silicon.
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