采用部分SOI工艺实现部分绝缘和大块mosfet的横向集成

Sung Hwan Kim, C. Oh, K. Yeo, D. Choi, Min Sang Kim, Sung Min Kim, J. Choe, J. Han, Young-pil Kim, Dong-Won Kim, Donggun Park, B. Ryu
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引用次数: 7

摘要

我们提出并成功演示了部分绝缘和块体mosfet,具有多个V/sub /s, I/sub on/s和I/sub Off/s,采用部分SOI工艺,无需复杂工艺和SOI晶圆。除部分SOI工艺外,适用于HP和LSTP晶体管的nMOS和pMOS在同一晶圆上采用相同工艺同时实现。这些结果对于实现需要各种规格的V/sub TH/s、I/sub On/s和I/sub Off/s的IC系统非常有用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Lateral integration of partially insulated and bulk MOSFETs using partial SOI process
We proposed and successfully demonstrated partially insulated and bulk MOSFETs with multiple V/sub th/s, I/sub on/s, and I/sub Off/s by using partial SOI process without complex process and SOI wafer. Both nMOS and pMOS applicable to the HP and LSTP transistors were simultaneously implemented on the same wafer with the same process except partial SOI process. These results must be very useful to implement IC systems requiring various specifications of V/sub TH/s, I/sub On/s, and I/sub Off/s.
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