作为失效分析工具的瞬态热响应。不同技术的比较

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2013-04-14 DOI:10.1109/EUROSIME.2013.6529959

D. May, B. Wunderle, R. Schacht, B. Michel

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引用次数: 14

摘要

为了满足更小、更可靠的电子设备的需求，新的封装技术是必要的。所谓的系统封装(SiP)概念将不同的技术、材料组合和工艺整合到一个封装中。为了保证这种封装的可靠性，需要对其进行可靠、快速、无损的失效分析。

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Transient thermal response as failure analytical tool - A comparison of different techniques

New packaging technologies are necessary to meet the demand for smaller and more reliable electronic devices. The so-called system-in-package (SiP) concept brings different technologies, material combinations and processes together in one package. To ensure the reliability of such a package reliable, fast and non-destructive failure analysis are needed.

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2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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